Fully testable surface mount die package configured for two-sided cooling

摘要

A power semiconductor die (50) is sandwiched between upper and lower heat conducting laminate structures (52, 54) to form a surface mount component that is configured for double-sided cooling. The upper heat conducting laminate structure (52) electrically couples top-side die terminal(s) (60) to conductors (72) formed on the inboard face of the lower heat conducting laminate structure (54), and all of the die terminals (56, 58, 60) are electrically coupled to conductors (24, 26, 28) formed on the outboard face of the lower heat conducting laminate structure (54). The die package can be placed in a test fixture for full power testing, and when installed in an electronic assembly (10) including a circuit board (16) and upper and lower heatsinks (12, 18), the die (50) is thermally coupled to the upper heatsink (12) through the upper heat conducting laminate structure (52), and to the lower heatsink (18) through the circuit board (16) and the lower heat conducting laminate structure (54).