| 摘要 |
Disclosed are a wafer-level lens array, a method of manufacturing a wafer-level lens array, a lens module, and an imaging unit capable of preventing the permeation of air into a substrate unit or a lens unit to be molded when a wafer-level lens array having the substrate unit and the lens units integrated with each other is molded. There is provided a method of integrally manufacturing a wafer-level lens array including a substrate unit and a plurality of lens units arranged on the substrate unit using a transfer mold (102) having a plurality of concave portions (102A) corresponding to at least the plurality of lens units (10) provided in a surface thereof. The method includes: supplying a resin to each concave portion, the amount of resin supplied being more than the volume of the concave portion; and performing molding to integrate the resin overflowing from the concave portions, thereby forming the substrate unit (1). |
