| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide the mounting structure of a semiconductor chip capable of firmly fixing the semiconductor chip and capable of reducing the effect of a stress due to a temperature change, and to provide a mounting method for the mounting structure. <P>SOLUTION: In the mounting structure of the semiconductor chip, an adhesive 4 composed of a high elastic material such as an epoxy resin is used for joining the semiconductor chip 1 such as an Si chip, an IC chip or the like; and a mounting substrate 2 in which an electrode as a thin-film composed of gold, nickel, copper or the like is formed on one surface of an insulating substrate 20 formed of ceramics, a resin or the like. In the mounting structure, the semiconductor chip 1 is mounted on the mounting substrate 2 by joining one-side side of the semiconductor chip 1 with the mounting substrate 2 by the adhesive 4 composed of the high elastic material. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
