发明名称 |
MICROSTRUCTURE, AND METHOD FOR PRODUCTION THEREOF |
摘要 |
<p>A microstructure which has excellent long-term stability and is capable of simple joining by thermocompression bonding at a high joint strength is provided. The microstructure includes an insulating base in which through micropores with a pore size of 10 to 500 nm are disposed at a density of 1 × 10 6 to 1 × 10 10 micropores/mm 2 . The through micropores are filled with a metal at a filling ratio of at least 30% and a polymer layer is formed on at least one surface of the insulating base.</p> |
申请公布号 |
EP2299452(A1) |
申请公布日期 |
2011.03.23 |
申请号 |
EP20090794425 |
申请日期 |
2009.07.07 |
申请人 |
FUJIFILM CORPORATION |
发明人 |
HATANAKA YUSUKE;SUZUKI SHINYA |
分类号 |
H01B5/16;H01B13/00;H01L21/60;H01R11/01;H05K1/14 |
主分类号 |
H01B5/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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