发明名称 MICROSTRUCTURE, AND METHOD FOR PRODUCTION THEREOF
摘要 <p>A microstructure which has excellent long-term stability and is capable of simple joining by thermocompression bonding at a high joint strength is provided. The microstructure includes an insulating base in which through micropores with a pore size of 10 to 500 nm are disposed at a density of 1 × 10 6 to 1 × 10 10 micropores/mm 2 . The through micropores are filled with a metal at a filling ratio of at least 30% and a polymer layer is formed on at least one surface of the insulating base.</p>
申请公布号 EP2299452(A1) 申请公布日期 2011.03.23
申请号 EP20090794425 申请日期 2009.07.07
申请人 FUJIFILM CORPORATION 发明人 HATANAKA YUSUKE;SUZUKI SHINYA
分类号 H01B5/16;H01B13/00;H01L21/60;H01R11/01;H05K1/14 主分类号 H01B5/16
代理机构 代理人
主权项
地址