HEAT-DISSIPATING SUBSTRATE AND FABRICATING METHOD OF THE SAME

摘要

PURPOSE: A heat-dissipating substrate and a fabricating method of the same are provided to help a user to mount a device having high resistance against heat and a device having low resistance against heat at the same time by filling an insulating material into the division region of anodic oxide metal plate. CONSTITUTION: A radiation substrate(100a) comprises; a plating layer(108) which is divided by a first insulating member(110) formed in a division region; a metal plate, having an anode oxidation layer on the surface, which is formed on the plating layer and has a second insulating member(114) in a region corresponding to the division region; and a circuit layer which is formed on the anode oxidation layer on the metal plate.