发明名称 Manufacturing method for a wafer lens module and the structure thereof
摘要 The present invention provides a manufacturing method for a wafer lens module including the steps of providing a plastic material with high thermal resistance, wherein the high temperature plastic material can be used at a reflow temperature above 250□; and forming the high temperature plastic material into a wafer lens module integrally. The method can form an integrated wafer lens module and simplify the manufacturing procedures. Furthermore, a wafer lens unit formed by stacking another wafer lens module on the wafer lens module manufactured by the method can have improved optical image quality.
申请公布号 US7911703(B2) 申请公布日期 2011.03.22
申请号 US20090461778 申请日期 2009.08.25
申请人 SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.;LITE-ON TECHNOLOGY CORPORATION 发明人 TSAI CHIA-HSI;TSENG CHENG-TE;CHEN TZU-KAN;KUO MENG-HSIN
分类号 G02B3/00;G02B7/00 主分类号 G02B3/00
代理机构 代理人
主权项
地址