发明名称 |
Manufacturing method for a wafer lens module and the structure thereof |
摘要 |
The present invention provides a manufacturing method for a wafer lens module including the steps of providing a plastic material with high thermal resistance, wherein the high temperature plastic material can be used at a reflow temperature above 250□; and forming the high temperature plastic material into a wafer lens module integrally. The method can form an integrated wafer lens module and simplify the manufacturing procedures. Furthermore, a wafer lens unit formed by stacking another wafer lens module on the wafer lens module manufactured by the method can have improved optical image quality.
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申请公布号 |
US7911703(B2) |
申请公布日期 |
2011.03.22 |
申请号 |
US20090461778 |
申请日期 |
2009.08.25 |
申请人 |
SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.;LITE-ON TECHNOLOGY CORPORATION |
发明人 |
TSAI CHIA-HSI;TSENG CHENG-TE;CHEN TZU-KAN;KUO MENG-HSIN |
分类号 |
G02B3/00;G02B7/00 |
主分类号 |
G02B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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