| 摘要 |
Disclosed is an imaging lens having both high heat resistance that enables the imaging lens to be mounted on a printed circuit board by a reflow mounting method and a high optical performance. The imaging lens includes: a first positive lens group; a second negative lens group; a third positive lens group; and a fourth positive or negative lens group. Each of the first to fourth lens groups includes a parallel plane glass plate and a resin lens that has heat resistance and is arranged on the parallel plane glass plate so as to be integrated with the parallel plane glass plate.
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