发明名称 Inductors for integrated circuit packages
摘要 An inductor may be formed from a magnetic film on a package substrate. Conductors coupled either to a die or a voltage converter extend perpendicularly through the film to conductive plates, defining current paths through and across the film.
申请公布号 US7911313(B2) 申请公布日期 2011.03.22
申请号 US20080217293 申请日期 2008.07.02
申请人 INTEL CORPORATION 发明人 GARDNER DONALD;SCHROM GERHARD;PAILLET FABRICE;CHICKAMENAHALLI SHAMALA
分类号 H01F27/28;H01F5/00;H01F7/06;H01F27/24 主分类号 H01F27/28
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