发明名称 |
Inductors for integrated circuit packages |
摘要 |
An inductor may be formed from a magnetic film on a package substrate. Conductors coupled either to a die or a voltage converter extend perpendicularly through the film to conductive plates, defining current paths through and across the film.
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申请公布号 |
US7911313(B2) |
申请公布日期 |
2011.03.22 |
申请号 |
US20080217293 |
申请日期 |
2008.07.02 |
申请人 |
INTEL CORPORATION |
发明人 |
GARDNER DONALD;SCHROM GERHARD;PAILLET FABRICE;CHICKAMENAHALLI SHAMALA |
分类号 |
H01F27/28;H01F5/00;H01F7/06;H01F27/24 |
主分类号 |
H01F27/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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