发明名称 Metallic electrode forming method and semiconductor device having metallic electrode
摘要 A metallic electrode forming method includes: forming a bed electrode on a substrate; forming a protective film with an opening on the bed electrode to expose the bed electrode from the opening; forming a metallic film covering the protective film and the opening; mounting the substrate on an adsorption stage, and measuring a surface shape of the metallic film by a surface shape measuring means; deforming the substrate by a deforming means so that a difference between the principal surface and a cutting surface is within a predetermined range; measuring a surface shape of the principal surface, and determining whether the difference is within a predetermined range; and cutting the substrate along with the cutting surface so that the metallic film is patterned to be a metallic electrode.
申请公布号 US7910460(B2) 申请公布日期 2011.03.22
申请号 US20100805537 申请日期 2010.08.05
申请人 DENSO CORPORATION 发明人 TOMISAKA MANABU;KOJIMA HISATOSHI;NIIMI AKIHIRO
分类号 H01L21/00 主分类号 H01L21/00
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