| 摘要 |
An electronic apparatus that includes a circuit substrate being installed in a casing. The electronic apparatus has first and second groove portions that are formed on a first surface and a second surface of a heat sink, respectively. The heat sink discharges heat from a heat element on the circuit substrate to the outside of the casing. The electronic apparatus has a through-hole portion that is formed at an intersection point of the first groove portion formed on the first surface of the heat sink and the second groove portion formed on the second surface of the heat sink.
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