发明名称 |
Multilayered printed circuit board, solder resist composition, and semiconductor device |
摘要 |
The present invention is to provide a multilayered printed circuit board free from cracks attributed to thermal expansion difference between a solder resist layer and another part and a multilayered printed circuit board of the present invention comprises a conductor circuit and a resin insulating layer serially formed on a substrate in an alternate fashion and in repetition and a solder resist layer formed as an outermost layer, and the solder resist layer contains an inorganic filler.
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申请公布号 |
US7910836(B2) |
申请公布日期 |
2011.03.22 |
申请号 |
US20070838365 |
申请日期 |
2007.08.14 |
申请人 |
IBIDEN CO. LTD. |
发明人 |
ZHONG HUI;SHIMADA KENICHI;TOYODA YUKIHIKO;ASAI MOTOO;WANG DONGDONG;SEKINE KOJI;ONO YOSHITAKA |
分类号 |
H05K1/03;H05K3/28;H05K3/46 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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