发明名称 Circuit board, electronic device and method for manufacturing the same
摘要 A circuit board includes a substrate, a circuit pattern and a through electrode. The circuit pattern is disposed on one side of the substrate in a thickness direction thereof. The through electrode is filled in a through-hole formed in the substrate with one end connected to the circuit pattern. The circuit pattern and the through electrode each have an area containing a noble metal component (e.g., Au component) and are connected to each other therethrough.
申请公布号 US7910837(B2) 申请公布日期 2011.03.22
申请号 US20080180831 申请日期 2008.07.28
申请人 NAPRA CO., LTD. 发明人 SEKINE SHIGENOBU;SEKINE YURINA;KUWANA YOSHIHARU
分类号 H05K1/11;H05K3/02;H05K3/10 主分类号 H05K1/11
代理机构 代理人
主权项
地址