发明名称 Surface acoustic wave device and method of fabricating the same
摘要 A surface acoustic wave device includes a piezoelectric substrate, an interdigital transducer (IDT) formed on the piezoelectric substrate, an interconnection electrode that is provided on the piezoelectric substrate and is connected to the IDT, the IDT being made of a metal identical to that of the IDT, an inorganic insulation layer that is provided on the piezoelectric substrate so that at least the interconnection electrode is exposed, an insulative resin layer that is located on an interface between the inorganic insulation layer and a portion of the interconnection electrode exposed from the inorganic insulation layer and is formed so as to cover a side surface of the interconnection electrode, and a metal layer that is provided on the interconnection electrode and the insulative resin layer.
申请公布号 US7911116(B2) 申请公布日期 2011.03.22
申请号 US20090410131 申请日期 2009.03.24
申请人 TAIYO YUDEN CO., LTD. 发明人 AIKAWA SHUNICHI;KITAJIMA MASAYUKI;TSUDA KEIJI
分类号 H03H9/25;H01L41/22 主分类号 H03H9/25
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