| 摘要 |
PURPOSE: A soldering apparatus of a lead frame is provided to prevent thermal deformation of a probe pin due to heat generated from a heat spraying unit by including a probe pin for fixing the lead frame to be separated from the heat spraying unit. CONSTITUTION: A bonding unit(100) is comprised of a pin fixing member(110) and a probe pin(120) which vertically move on the end of a robot arm(3). The probe pin fixes a cell by pressurizing a lead frame(2) which is positioned on the upper side of the cell. A soldering unit is comprised of an air supply member(220), a heat spraying member(230), and a moving body(240). The air supply member supplies air through a plurality of supply ports(221). The heat spraying member sprays the air to the lead frame side by heating the air supplied from the air supply member.
|
