| 摘要 |
PURPOSE: A base metal printed circuit board for hi-effective light-emitting diode package and a method thereof are provided to maximize the electrical insulation and thermal-proof effect by including a thermal resin layer and a thermal separation layer. CONSTITUTION: A metallic board(210) is formed with a penetration hole passing through the upper and the lower part. Top and bottom thermal separation layers(222, 224) are made of ceramic material having the electrical insulation and thermal conductivity. Top and bottom thermal resin layers(232, 234) are made of thermosetting resin having the electrical insulation and thermal conductivity. |
