ELECTROMAGNETIC INTERFERENCE NOISE REDUCTION BOARD USING ELECTROMAGNETIC BANDGAP STRUCTURE
摘要
PURPOSE: A printed circuit board for reducing an EMI noise is provided to shield a radiation noise by inserting an electromagnetic bandgap structure into the substrate. CONSTITUTION: A ground layer and a power layer are formed on a first region(100). A second region is positioned on the side of the first region and includes an electromagnetic bandgap structure to shield an EMI noise emitted to the outside through the side of the first region. A first conductive plate(220a) and a second conductive plate(220b) are formed on the same plane along the side of the first region. A stitching via part(250) electrically connects the first and second conductive plates.
申请公布号
KR101023541(B1)
申请公布日期
2011.03.21
申请号
KR20090089799
申请日期
2009.09.22
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
HAN, MI JA;KIM, HAN;PARK, DAE HYUN;JUNG, HYO JIC;BONG, KANG WOOK