LIQUID JETTING HEAD, METHOD FOR MANUFACTURING THE SAME, AND LIQUID JETTING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a liquid jetting head which surely protects a circuit board from a liquid, a method for manufacturing the same, and a liquid jetting apparatus. SOLUTION: The liquid jetting head includes a holder member 500 supporting the circuit board 600 and provided with a feeding path 503 and a seal member 710 for covering the circuit board 600. On a supporting face of the circuit board 600 of the holder member 500, there is provided a projecting part 503a with an opening of the feeding path 503. The seal member 710 is provided with an inserting hole 713 through which the projecting part 503a is inserted. An adhesive receiving part 715 provided on the opposite face side to the holder member 500 of the seal member 710 is constituted of an adhesive introducing channel 716 separately provided from the inserting hole 713 and a feeding channel 717 continuously formed to the inserting hole 713 from the adhesive introducing channel 716. A clearance between the inserting hole 713 and the projecting part 503a is sealed with an adhesive introduced from the adhesive introducing channel 716. COPYRIGHT: (C)2011,JPO&INPIT