发明名称 PACKAGE WITH INTEGRATED LENS AND OPTICAL ASSEMBLY INCORPORATING PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide a package including an integrated lens capable of collimating light emitted and received by an optoelectronic device enclosed within the package. SOLUTION: A package includes a cap (22) including a recess (28) in which a laser (30) and a monitor diode (32) are mounted. A lens (34) is integrated with the package for collimating light. The lens is a spherical lens (34) attached within a plate (24) or a microlens that is surface-machined integrally with a base (26). An optoelectronic device is hermetically sealed within the package. A hermetically sealed inter-surface connection terminal (46) may be used to connect a metal coating within the recess (28) and an electrical contact on the outer side of the package. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011054995(A) 申请公布日期 2011.03.17
申请号 JP20100264104 申请日期 2010.11.26
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD 发明人 KILIAN ARND
分类号 H01S5/022;G02B6/42 主分类号 H01S5/022
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