发明名称 OXYGEN-BARRIER PACKAGED SURFACE MOUNT DEVICE
摘要 A method for producing a surface mount device (100) includes providing a plurality of layers including a B-staged top layer (300) and bottom layer (315), and a C- staged middle layer (310) with an opening (312). A core device (305) is inserted into the opening, and then the top and bottom layers are placed over and under, respectively, the middle layer. The layers are cured until the layers become C-staged. The core device is substantially surrounded by an oxygen-barrier material with an oxygen permeability of less than approximately 0.4 cm3·mm/m2·atm·day.
申请公布号 WO2011008294(A3) 申请公布日期 2011.03.17
申请号 WO2010US02004 申请日期 2010.07.16
申请人 TYCO ELECTRONICS CORPORATION;NAVARRO, LUIS, A.;GOLDEN, JOSH, H.;MATTHIESEN, MARTYN, A. 发明人 NAVARRO, LUIS, A.;GOLDEN, JOSH, H.;MATTHIESEN, MARTYN, A.
分类号 H01C1/142 主分类号 H01C1/142
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