| 摘要 |
Provided is a reduction-type electroless tin plating solution suitable for practical use, which rarely causes replacement reaction on a substrate consisting of either copper or a copper alloy, which enables high-speed stable deposition, which is stable and attains high productivity, and which causes neither breaking of a conductor nor outgrowth of tin even when the conductor has a fine form. The reduction-type electroless tin plating solution is characterized by comprising, as the essential constituents, a water-soluble tin compound, a water-soluble titanium compound, an organic complexing agent, and an organosulfur compound selected from the group consisting of mercaptans and sulfides. |
