SEMICONDUCTOR CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor chip package and a method for manufacturing the same are provided to form a rewiring pattern by a conductive paste including metallic powder and binder resins using a stencil. CONSTITUTION: A semiconductor chip(10) comprises an active surface(12) where a chip pad(11) is formed. An insulation layer(30) is formed on the active surface. The insulation layer comprises an opening exposing one area of the chip pad. A rewiring pattern(40) is electrically connected to the chip pad through the opening. The rewiring pattern is made of a conductive paste including metallic powder and binder resins.