| 摘要 |
PROBLEM TO BE SOLVED: To provide a piezoelectric device which keeps an adhesive strength between integrated circuit elements and lead without using a resin package, and has excellent productivity, and to provide a method of manufacturing the piezoelectric device. SOLUTION: The method of manufacturing the piezoelectric device having a lead formed of a leg part, a mount part and an exterior connection part which are prepared on both ends of the lead, includes: an integrated circuit element mounting step of mounting an integrated circuit element on one main surface of the mount part prepared on the lead; a component element mounting step of mounting a component element on the other main surface of the mount part prepared on the lead; and a resin filling step of injecting a resin between the integrated circuit element mounted on the one main surface of the lead and the component element mounted on the lead, and then hardening the resin. The piezoelectric device manufactured by this method is provided. COPYRIGHT: (C)2011,JPO&INPIT |
