| 摘要 |
An assembly of a die ejecting device and an image capture device includes: an ejector main body; the die ejecting device provided on the ejector main body and configured for ejecting a die adhered to a tape; and the image capture device provided inside the die ejecting device and including: an image capture element for taking images of the ejected die; and an internal light source. Thus, not only can images be simultaneously taken of a die in a wafer and a waiting-to-be-bonded position, but also subsequent die testing and position calibration are made easy. The die can be directly bonded to a die bonding position on a substrate from below, thereby sparing the programs and mechanisms otherwise required for conveying the die with a pick-and-place arm. Consequently, the die transportation time and overall bonding cycle time are shortened, and the production capacity of the die bonding machine is enhanced.
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