| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic device including a composite board using a plurality of through-wiring board including through-wiring high in the degree of freedom in design of a wiring structure, and allowing high-density three-dimensional packaging. <P>SOLUTION: The electronic device includes: a composite substrate including through-wires 183 formed by arranging minute holes to connect at least two surfaces constituting a base material, and filling a conductive substance in the minute holes, and composed by using a plurality of through-wiring boards 181A-181D where each through-wire has a part extending in a direction different from the thickness direction of the base material at least partially, superposing principal surfaces on one another and/or side faces on one another, and electrically connecting the through-wires 183 constituting the through-wiring boards to one another; and electronic components 185A-185D mounted on the base material in the through-wiring board. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
