发明名称 |
CONDUCTIVE PASTE, ELECTRODE FOR SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide: conductive paste capable of being manufactured at low cost with degradation of characteristics of a semiconductor device restrained; an electrode for a semiconductor device; a semiconductor device; and a method of manufacturing a semiconductor device. <P>SOLUTION: The conductive paste contains conductive powder made of a plurality of conductive particles, each of which is provided with a base material and a conductive layer coating at least a portion of its outer surface. The conductive paste is used for forming an electrode for a semiconductor device and a semiconductor device as well as a method of manufacturing a semiconductor device. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
申请公布号 |
JP2011054313(A) |
申请公布日期 |
2011.03.17 |
申请号 |
JP20090200189 |
申请日期 |
2009.08.31 |
申请人 |
SHARP CORP |
发明人 |
TANAKA SATOSHI;YAMAMOTO SHINYA |
分类号 |
H01B1/22;H01B1/00;H01B5/14;H01L31/04 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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