发明名称 CONDUCTIVE PASTE, ELECTRODE FOR SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide: conductive paste capable of being manufactured at low cost with degradation of characteristics of a semiconductor device restrained; an electrode for a semiconductor device; a semiconductor device; and a method of manufacturing a semiconductor device. <P>SOLUTION: The conductive paste contains conductive powder made of a plurality of conductive particles, each of which is provided with a base material and a conductive layer coating at least a portion of its outer surface. The conductive paste is used for forming an electrode for a semiconductor device and a semiconductor device as well as a method of manufacturing a semiconductor device. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011054313(A) 申请公布日期 2011.03.17
申请号 JP20090200189 申请日期 2009.08.31
申请人 SHARP CORP 发明人 TANAKA SATOSHI;YAMAMOTO SHINYA
分类号 H01B1/22;H01B1/00;H01B5/14;H01L31/04 主分类号 H01B1/22
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