| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting insulating resin composition having low thermal expansion, high glass transition temperature, and excellent heat resistance, and an insulating film with a substrate, a prepreg, a laminated board, and a multilayer printed wiring board using the same. SOLUTION: The thermosetting insulating resin composition is used, which contains: a curing agent (A) having an acidic substituent and an N-substituted maleimide group obtained by the reaction of (a) a diamine compound having a biphenyl skeleton in the molecular main chain, (b) a maleimide compound having at least two N-substituted maleimide groups in the molecular structure, and (c) a monoamine compound; an epoxy resin (B) having at least two epoxy groups in one molecule; and a compound (C) capable of chemical roughening. COPYRIGHT: (C)2011,JPO&INPIT |
