| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating method for plating even a fine pore of a workpiece without complicating facilities or processes. SOLUTION: The fine pore 11 of the workpiece 10 is filled with saturated water vapor. As saturated water vapor is gas similar to air, air 15 remaining in the fine pore 11 is replaced by water vapor 16. When the workpiece 10 having the fine pore 11 filled with the water vapor 16 is cooled, the water vapor 16 filling the fine pore 11 is condensed, and the condensed water vapor 16 covers the inner surface of the fine pore 11 in a state of a wafer film 17. Since both of the water film 17 condensed on the surface of the fine pore 11 and a plating liquid 19 are liquid, the plating liquid 19 intrudes into the fine pore 11 without influenced by the surface tension. As a result, the water film 17 produced by condensation of water in the fine pore 11 is easily replaced by the plating liquid 19 when the object 10 having the water film 17 formed in the fine pore 11 is immersed in the plating liquid 19. COPYRIGHT: (C)2011,JPO&INPIT
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