发明名称 MULTILAYER CHIP CAPACITOR
摘要 PROBLEM TO BE SOLVED: To provide a multilayer chip capacitor adaptable to miniaturization and having high reliability by effectively reducing possibility of a short circuit between external electrodes arranged on opposite side faces of a capacitor body. SOLUTION: The multilayer chip capacitor includes: a capacitor body where a plurality of dielectric layers are laminated and formed, and which has first and second side faces opposing to each other and third and fourth side faces opposing to each other; a plurality of internal electrode layers laminated by being separated with the dielectric layers in the capacitor body; one or more first external electrodes formed on the first side face; and one or more second external electrodes formed on the second side face. The first and second external electrodes are arranged to be offset from each other and are spaced apart from each other at a predetermined distance in a length direction of the first side face. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011054989(A) 申请公布日期 2011.03.17
申请号 JP20100251296 申请日期 2010.11.09
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 LEE BYOUNG HWA;WI SUNG KWON;CHUNG HAE SUK;PARK DONG SEOK;PARK SANG SOO;PARK MIN CHEOL
分类号 H01G4/30;H01G4/12;H01G4/35 主分类号 H01G4/30
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