发明名称 Method of manufacturing a semiconductor device in which an increase in area of the semiconductor device is suppressed
摘要 A method of manufacturing a semiconductor device includes: performing, in a case of manufacturing a first semiconductor device which operates by a first power supply voltage, at least one step from among channel ion implantation, gate oxide film formation, and gate electrode patterning according to a process of forming an element which operates with the first power supply voltage; performing, in a case of manufacturing a second semiconductor device which operates by a second power supply voltage, at least one step from among the channel ion implantation, the gate oxide film formation, and the gate electrode patterning according to a process of forming an element which operates with the second power supply voltage; and commonly performing at least diffusion region formation in the case of manufacturing the first semiconductor device and in the case of manufacturing the second semiconductor device.
申请公布号 US2011065249(A1) 申请公布日期 2011.03.17
申请号 US20100805016 申请日期 2010.07.07
申请人 ELPIDA MEMORY, INC. 发明人 EGAWA HIDEKAZU
分类号 H01L21/336 主分类号 H01L21/336
代理机构 代理人
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