发明名称 |
WIRING BOARD AND MANUFACTURING METHOD THEREOF |
摘要 |
A wiring board includes a substrate having a surface made of an insulating resin. An adhesion layer is formed on the substrate. A wiring layer is formed on the adhesion layer. The adhesion layer is formed by a nitrided NiCu alloy containing nitrogen therein. A nitrogen content of the nitrided NiCu alloy is within a range from 1 atoms % to 5 atoms %.
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申请公布号 |
US2011061916(A1) |
申请公布日期 |
2011.03.17 |
申请号 |
US20100869805 |
申请日期 |
2010.08.27 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
YAMASAKI TOMOO |
分类号 |
H05K1/02;H05K3/10 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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