发明名称 Circuit board and method of manufacturing the same
摘要 There is provided a circuit board. The circuit board according to an aspect of the invention may include: an insulating base body; a plurality of circuit patterns including a first conductive pattern and a second conductive pattern facing the first conductive pattern at a predetermined interval therebetween; a printed resistor connecting the first conductive pattern and the second conductive pattern; and a heat radiation pattern provided on the insulating base body and overlapping at least partially overlapping the printed resistor. According to an aspect of the invention, a circuit board facilitating a design of a heating structure by forming a printed resistor on a circuit board and forming a heat radiation structure overlapping or connected to the printed resistor, and a method of manufacturing the same can be provided.
申请公布号 US2011061902(A1) 申请公布日期 2011.03.17
申请号 US20090654674 申请日期 2009.12.29
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE HEE BUM;CHAE KYOUNG SOO
分类号 H05K1/00 主分类号 H05K1/00
代理机构 代理人
主权项
地址