发明名称 |
Circuit board and method of manufacturing the same |
摘要 |
There is provided a circuit board. The circuit board according to an aspect of the invention may include: an insulating base body; a plurality of circuit patterns including a first conductive pattern and a second conductive pattern facing the first conductive pattern at a predetermined interval therebetween; a printed resistor connecting the first conductive pattern and the second conductive pattern; and a heat radiation pattern provided on the insulating base body and overlapping at least partially overlapping the printed resistor. According to an aspect of the invention, a circuit board facilitating a design of a heating structure by forming a printed resistor on a circuit board and forming a heat radiation structure overlapping or connected to the printed resistor, and a method of manufacturing the same can be provided.
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申请公布号 |
US2011061902(A1) |
申请公布日期 |
2011.03.17 |
申请号 |
US20090654674 |
申请日期 |
2009.12.29 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE HEE BUM;CHAE KYOUNG SOO |
分类号 |
H05K1/00 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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