SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

摘要

Strong ultrasonic waves can be applied while holding and fixing holding regions (310a, 310b) at the time of performing bonding by using a ribbon, by adding the holding regions (310a, 310b) to a pad-shaped section (303a) of a lead, a die pad (302) and the like which are to be electrically connected by using a conductive ribbon (309).  Therefore, the resistance of a bonding section can be reduced, while firmly bonding the conductive ribbon (309).  Furthermore, since the bonding strength of the conductive ribbon (309) is improved, the conductive ribbon (309) is not required to be stacked in multilayer, and stress to a semiconductor chip (306) due to ultrasonic waves can be easily reduced.