PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF MANUFACTURING PATTERN-CURED FILM USING THE SAME, AND ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition, a film of which even when cured at ≤250°C, after curing ensures physical properties comparable to those of a film cured at a high temperature, to provide a method of manufacturing a pattern-cured film using the resin composition, and to provide electronic components.

SOLUTION: The photosensitive resin composition includes: (a) a polybenzoxazole precursor having a structural unit represented by general formula (I) (wherein U and V each represent a divalent organic group, provided that at least one of U and V is a group containing a 1-30C aliphatic chain structure); (b) a photosensitive agent; (c) a solvent; (d) a crosslinking agent which enables crosslinking or polymerization upon heating; and (e) a silane coupling agent having a urea bond.

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