| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve reliability of a connection between an interlayer connection body and a wiring pattern. <P>SOLUTION: A printed wiring board includes: an insulating plate having a first surface and a second surface; a first and second metal wiring patterns formed on the first and second surfaces of the insulating plate; and the interlayer connection body penetrating the insulating plate to be sandwiched between surfaces of the first and second metal wiring patterns. The interlayer connection body contains particles of a first metal having surfaces covered with a multi-element-based phase of≥260°C in melting point, and the multi-element-based phase is a composition-based phase of a second metal as one composition of the predetermined low-melting-point metal of≤240°C in melting point and the first metal. Multi-element-based phases on respective surfaces of the particles of the first metal are mutually connected to form a conductive skeleton structure. On an interface between the surfaces of the first and second metal wiring patterns, a second multi-element is formed which is a composition system of a metal that the first and second metal wiring patterns contain and the second metal, and has a melting point of≥260°C. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
