| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thermosetting insulating resin composition of a low thermal expansion property, with a high glass transition temperature and excellent heat resistance, an insulating film with a substrate using the same, a prepreg, a laminated board, and a multilayer printed circuit board. <P>SOLUTION: The thermosetting insulating resin composition includes (A) a curing agent including an acidic substituent and an N-substituted maleimide group obtained by reacting (a) a diamine compound having a biphenyl skeleton in the principal molecular chain, (b) a maleimide compound having at least two N-substituted maleimide groups in the molecular structure and (c) a monoamine compound, (B) an epoxy resin having at least two epoxy groups in the molecule, and (C) a phosphorous compound providing flame retardancy. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
