发明名称 ADHESIVE FOR BONDING ELECTRIC ELEMENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an adhesive for bonding electric element with superior coating properties and storage stability, the adhesive preventing the increase of viscosity caused by addition of an imidazole compound. <P>SOLUTION: The adhesive for bonding electric element contains a curable compound, the imidazole compound and a polyvinyl phenol. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011054769(A) 申请公布日期 2011.03.17
申请号 JP20090202504 申请日期 2009.09.02
申请人 SEKISUI CHEM CO LTD 发明人 HAYAKAWA AKINOBU;ISHIZAWA HIDEAKI;MASUI RYOHEI;FUJIWARA AKIHIKO
分类号 H01L21/52;C09J11/06;C09J11/08;C09J201/00 主分类号 H01L21/52
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