发明名称 DIFFICULT-TO-CUT MATERIAL CUTTING METHOD, AND DIFFICULT-TO-CUT MATERIAL CUTTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a difficult-to-cut material cutting method and a difficult-to-cut material cutting device which eliminates a rise of a temperature rise and the wear of a diamond tool in the cutting of highly-hard and brittle materials such as a die material, optical glass, and a single-crystal material. SOLUTION: In an ultraprecision cutting process, the cutting method makes the center of curvature 5 of a cutting tool 4 having an arcuate cutting blade 3 and the center 10 of a rotary table 9 of a B-axis of a machine to which the cutting tool 4 is attached coincide with each other, and oscillates the rotary table 9 to always move a cutting point of the cutting tool 4 on an arc. The cutting method measures in advance an error in the depth of cut to be caused by the oscillation of the cutting tool 4 during the oscillation of the rotary table 9 and correctively controls the machine using an NC program based on the error data. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011051030(A) 申请公布日期 2011.03.17
申请号 JP20090199414 申请日期 2009.08.31
申请人 TOHOKU UNIV 发明人 EN KIO
分类号 B23B1/00 主分类号 B23B1/00
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