| 摘要 |
Inductive coupling modules for providing power to secondary devices placed in proximity thereto on a surface are described. The modules include above-surface, flush, recessed, and sub-surface mounting configurations. The modules further include dual housing, single housing, low-profile, and adjustable configurations. Inductively coupled power distribution circuits are also disclosed. The circuits comprise a plurality of segments that are inductively couple together to eliminate wired connections between segments. Each segment may be attached to a section of a modular furniture component to allow ease and safety in rearranging the modular furniture and ease in reconnecting the circuit.
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