| 摘要 |
Optical subassemblies including optical transmit and receive subassemblies. The optical subassemblies comprise a housing, and first and second substrates mounted within the housing. Also disposed within the housing is a thermoelectric cooler (TEC) thermally coupled to the first substrate. An optical transmitter is mounted on the first substrate, and thermally coupled to the TEC. A TEC driver is mounted on the second substrate and electrically coupled to the TEC. In some embodiments a thermal resistance mechanism is provided for connecting the first substrate to the second substrate.
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