DICING DIE BONDING TAPE, AND METHOD OF MANUFACTURING SEMICONDUCTOR CHIP

摘要

PROBLEM TO BE SOLVED: To provide a dicing die bonding tape that can suppress sticking of cut waste on a semiconductor chip with a pressure-sensitive adhesive layer during dicing of a semiconductor wafer and reasonably pick up the semiconductor chip with the pressure-sensitive adhesive layer after dicing. SOLUTION: The dicing die bonding tape 1 has the pressure-sensitive adhesive layer 3 and a non-adhesive layer 4 laminated on the pressure-sensitive adhesive layer 3, the non-adhesive layer 4 is formed of a cross-linked body obtained by cross-linking a composition containing an acrylic polymer and a filler having a reactive double bond group on a surface. COPYRIGHT: (C)2011,JPO&INPIT