| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve a problem that an unfilled region is formed in a resin package, in a conventional circuit device. <P>SOLUTION: In a circuit device, a plurality of leads 5 are led out of both side surfaces 3 and 4 in a length direction of a resin package 2. The leads 5 are arranged separately at the side surface 4 side of the resin package 2, and a gate for injecting resin is arranged in its central region. At a front surface side of the resin package 2, a groove 10 is formed for controlling a flow of the resin. By this structure, a depth in a resin injection direction becomes shorter to adjust a packing speed of the resin at the front surface side of a circuit board 15. Thus, air in a cavity is exhausted to prevent a formation of a non-packed region of the resin package 2. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
