| 摘要 |
PROBLEM TO BE SOLVED: To provide a cutting device that achieves improvement in machining efficiency by using two chuck tables. SOLUTION: First/second chuck tables 5a, 5b are moved among a first cutting region A1 where a semiconductor wafer W is cut by first/second blade units 41, 42, a second cutting region A3 where the semiconductor wafer W is cut by a third blade unit 73, and an alignment region A2 where alignment processing is executed. While the semiconductor wafer W held on either one of the first/second chuck tables 5a, 5b is cut by the first/second blade units 41, 42 in the first cutting region A1, the semiconductor wafer W held on either the other of the first/second chuck tables is subjected to alignment in the alignment region A2 and the aligned semiconductor wafer is cut by the third blade unit 73 in the second cutting region A3 after the alignment. COPYRIGHT: (C)2011,JPO&INPIT |
