| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a chip-integral package, and a semiconductor device. <P>SOLUTION: The chip-integral package includes: an insulating layer 14 laminated on a semiconductor substrate 12; a solenoid-type inductor 28 that is formed in an embodiment of being embedded in the insulating layer 14 while falling sideways and makes electrical connection to either a circuit formed on the semiconductor substrate 12 or an external circuit; and a pair of metal members (metal film 34, metal plate 35) formed in an embodiment of being embedded in a position for blocking an opening 28a across the inductor 28 in the insulating layer 14. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
