| 摘要 |
<p>Disclosed is a substrate inspecting apparatus, which has: an inspecting apparatus main body section that performs electrical inspection of a substrate having an electronic circuit and an electrode pad formed thereon; and a contactor electrically connected to the inspecting apparatus main body section. In the contactor, a contact section is formed of a conductive material on a semiconductor wafer, and the electric circuit on the substrate is inspected by electrically connecting together the contact section and the electrode pad on the substrate.</p> |
