| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an alkali-developable photocurable resin composition excellent in developability (particularly in a through-hole part), having high sensitivity and excellent in soldering heat resistance, electroless gold plating resistance, electric insulation and the like, a dry film and cured product of the composition, and a printed wiring board on which a cured coating such as a solder resist is formed with the dry film or cured product. <P>SOLUTION: The photocurable resin composition contains: a polyol represented by general formula (1); a carboxyl group-containing resin; and a photopolymerization initiator. The polyol is a polyol obtained by depolymerizing (a) a polyester with (b) a polyol having a plurality of hydroxyl groups in one molecule, preferably trimethylolpropane or/and polycarbonate diol. The photocurable resin composition further contains a thermocurable component or further includes a compound having a plurality of ethylenically unsaturated groups in its molecule. <P>COPYRIGHT: (C)2011,JPO&INPIT |
