| 摘要 |
PROBLEM TO BE SOLVED: To improve a positioning accuracy of a component of a substrate treatment device higher than that of a prior art without increasing an insertion accuracy of positioning pins into positioning holes. SOLUTION: A substrate treatment device includes: a mounting table 110 including a susceptor 114 having a substrate mounting surface 115 on which a wafer W is mounted and a focus ring mounting surface 116 on which a focus ring 124 is mounted; and a plurality of positioning pins 200 that are formed of materials expandable in a radial direction by heating and formed in pin shapes, inserted into a positioning hole (first reference hole) formed on the focus ring mounting surface of the susceptor and into a positioning hole (second reference hole) formed at the focus ring, and expanded in the radial direction by heating to be fit into the positioning holes, so that the focus ring is positioned. COPYRIGHT: (C)2011,JPO&INPIT |
