| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method which can remove contaminants adhering to a substrate while preventing the generation of damage such as collapse of finer pattern. SOLUTION: The substrate processing apparatus 1 includes a nozzle 10 which ejects liquid droplets of very fine particles and a liquid droplet atomizer which atomizes the liquid droplets ejected from the nozzle 10 to supply the atomized liquid droplets to a substrate W. For example, the liquid droplet atomizer is a holding member 23. The holding member 23 arranges the plurality of nozzles 21 and 22 in a way that the liquid droplets ejected from the plurality of nozzles 21 and 22 intersect with one another, and forms a liquid-droplet intersecting area H generated from the collapse of the liquid droplets by intersecting the liquid droplets ejected from the plurality of nozzles 21 and 22. COPYRIGHT: (C)2011,JPO&INPIT |
