| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of solving a problem of a conventional method of peeling a displacement plating layer that an electrolytic plating layer is simultaneously peeled off when the displacement plating layer is peeled off. SOLUTION: The displacement plating layer is selectively peeled off with a peeling liquid 40 by forming the electrolytic plating layer on the exposed surfaces of lead wires 18, 18 by performing electrolytic plating to a member 10 of a semiconductor device on which the lead wire 18, 18 are mounted to be electrically insulated from a metal forming the surface of a stem 12 while feeding current only to the lead wires 18, 18 and after that, immersing the member 10 of the semiconductor device into the peeling solution 40 which has a peeling performance of peeling the plating metal forming the electrolytic plating layer and to which an electrolyte is added while feeding current to the lead wires 18, 18. COPYRIGHT: (C)2011,JPO&INPIT |
