| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip-integral package and a semiconductor device. SOLUTION: A chip-integral package includes an insulating layer 14 laminated on a semiconductor substrate 12, a solenoid-type inductor 28 that is formed in a form of being embedded in the insulating layer 14 while being fallen sideways and establishes electrical connection to either a circuit formed on the semiconductor substrate 12 or an external circuit, and a pair of magnetic members (a magnetic plate 35, a magnetic film 36, and a magnetic resin 38) formed in a form of being embedded in a position for blocking an opening 28a across the inductor 28 in the insulating layer 14. COPYRIGHT: (C)2011,JPO&INPIT |
