| 摘要 |
A bonding apparatus includes: a storage unit that stores bonding conditions of a ball; a detection unit that detects a first position on a Z axis of a capillary with the ball coming into contact with a semiconductor element and detects a second position on the Z axis of the capillary when the ball at the tip end of the capillary is bonded to the semiconductor element; a calculation unit that calculates a collapse amount of the ball which is a difference between the first position and the second position detected by the detection unit and a bonding time and calculates a collapse amount of the ball for a predetermined period; and a first adjustment unit that adjusts the bonding conditions when the collapse amount of the ball for a predetermined period is outside a predetermined numerical range.
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